Thin Film Bus Wire Data Sheet

1. Size:

Copper core dimension

  • Width: 2.0-12.7mm +/- 0.08
  • Thickness: ≥0.035 mm +/- 0.008

 

2. Chemical Composition Base Material:

Material

  • CDA 102 – ASTM B170
  • CDA 110 – ASTM B5
  • ETP1 – DIN EN 13602

 

3. Mechanical Properties:

Measurement method: The pull force is measured on the finished copper wire after annealing.
The pull force is then divided by the total nominal cross section of the copper core only.
Testing is done in accordance with SEMI PV RIBBON STANDARDS PV018-0811 and PV019-0811
  • Tensile Strength:
  • Yield Strength: According to Customer Specifications
  • Elongation:

 

4. Coating:

Solder Coated Copper Wire – All sides coated

  • Leaded Solder Alloys Sn62Pb36Ag2 and Sn60Pb40
  • Lead Free Solder Alloys Sn100 and Sn96.5Ag3.5
  • Other solder alloys are available on request

Solder Coating Thickness 1-3 µm PEAK

*According to Customer Specifications

Peak Average

 

5. Straightness:

Measuring Method: Freely suspend ribbon sample weighted with 10g

 

Camber: According to Customer Specifications

 

6. Packing:

Pancake Coils on Cores or Cardboard Reels (see Packaging Brochure)

 

NOTE:  The information provided above is based on our current standard knowledge and does not claim to be exhaustive.  This information may not be passed on to third parties without approval by Ulbrich Solar Technologies, Inc.